China PCB Assembly PCBA 18 SMT Lines Manufacturer Nitrogen Reflow Oven

Product Description

China PCBA Manufacturer | 24 Years Expertise | 18 SMT + 13 DIP Lines

Your Trusted Turnkey PCB Assembly Partner

With 23 years of industry experience, we are a leading PCBA manufacturer in China, offering end-to-end solutions from prototyping to mass production. Our 18 fully automated SMT lines and 13 DIP lines serve global clients in automotive, industrial, IoT, and medical sectors with IPC-A-610 Class 2/3 standards.

 

Core Capabilities

 High-speed SMT Assembly:
• 18 SMT lines ( Yamaha, Samsung)
• Component range: 01005 ~ BGA | 0.2mm fine-pitch
• Daily output: 8M+ solder points | 99.2% on-site pass rate

 

 DIP/THT Production:
• 13 lines with selective soldering & wave soldering
• Max board size: 600mm × 500mm

 

 Quality Assurance:
• Full traceability (MES/ERP)
• Testing: AOI, 3D X-Ray, ICT, FCT
• Certifications: ISO 9001, IATF 16949, ISO 13485, ISO14001
 

Competitive Advantages
 23-year proven track record in complex PCBA
 One-stop service: PCB fabrication → component sourcing → assembly → testing → logistics
 Rapid prototyping: 24-hour turnaround for urgent orders. Cost optimization: Lean manufacturing & China-based supply chain

Factory 1 4,000 square meters
600+ employees,Provide one-stop PCB/PCBA service,full turnkey,competitive pricing,strict QC,fast delivery

50 production lines
18 SMT lines with nitrogen reflow, 13 DIP lines, 6 cnformal coating lines,  6 function test lines, 2 burning programming lines, 4 finished assemble lines
 

Certification
IATF16949,ISO13485,ISO9001, ISO14001

18 SMT lines
Operating 18 SMT lines with 01005-capable precision placement and nitrogen-reflow soldering, this facility serves automotive, medical, and aerospace sectors while addressing yield, lead time, and cost priorities. The nitrogen atmosphere delivers void-free joints surviving 150°C engine conditions with PPM-level defects. Medical assembly ensures six-sigma Cpk≥2.0 and full traceability per FDA/ISO 13485. Aerospace applications maintain solder porosity below 1% under thermal shock, with parallel 18-line setup enabling 30% faster turnarounds. This combination consistently reduces per-unit cost by 15-22% while ensuring mission-critical reliability worldwide.

13 DIP lines
Operating 13 DIP assembly lines, precision fluxing, wave soldering, and AOI at every process stage, this facility delivers robust through-hole soldering solutions for automotive, industrial, medical,new energy. The closed-loop AOI feedback system catches insertion defects and solder bridging in real time, ensuring first-pass yields above 99.5%. Wave soldering with optimized flux application eliminates cold joints and voids on heavy copper boards. The 13-line parallel configuration enables rapid order turnarounds and scalable batch production, reducing per-unit labor costs while maintaining consistent quality across high-reliability applications worldwide.

Components warehouse
Constant temp/humidity storage,anti-static,traceability,FIFO control.Operating a components warehouse with constant temperature/humidity control, anti-static protection, full traceability, and FIFO inventory management, this facility ensures optimal material integrity for moisture-sensitive and ESD-vulnerable electronic components. The climate-controlled environment prevents oxidation and solderability degradation, extending component shelf life by over 300%. Real-time barcode tracking with FIFO discipline eliminates expired material usage and reduces obsolescence write-offs by 25%. The anti-static flooring and packaging safeguard sensitive devices against latent ESD damage, while full lot traceability supports rapid recall and root-cause analysis for automotive and medical compliance requirements worldwide.

PCBA First Piece Tester
Utilizing a PCBA first-piece tester, this facility verifies component placement, polarity orientation, soldering quality, and basic electrical functionality before mass production release. The automated inspection system compares the initial assembled board against CAD data and BOM specifications, instantly flagging misloaded parts, reversed diodes, and insufficient solder fillets. This upstream quality gate captures defects at the source, preventing costly rework and scrap across full production runs. By validating first-article correctness within minutes, the tester slashes setup verification time by 70%, reduces line downtime, and ensures zero-defect launch for subsequent volume production - a critical safeguard for automotive and medical programs where non-conformance costs are exceptionally high.

DIP Automated Optical Inspection
Deploying DIP automated optical inspection systems before and after wave soldering, this facility verifies through-hole component presence, polarity, solder joint integrity, bridging, and voiding with high-speed precision. The dual-stage AOI configuration captures pre-solder insertion errors and post-solder defects simultaneously, enabling immediate correction before defects propagate downstream. Automated algorithm detection identifies insufficient fill, skewed leads, and excess solder that compromise mechanical strength. This closed-loop inspection approach reduces manual visual inspection dependency by 85%, cuts rework labor costs significantly, and ensures consistent through-hole soldering quality for industrial controls, power supplies, and automotive modules where connection reliability is paramount.

Professionals Engineering Department 
Supported by an engineering team of over 50 professionals, this facility delivers comprehensive technical expertise spanning component selection, SMT process optimization, electrical fault diagnosis, soldering quality assurance, and ICT/FCT/AOI testing. The cross-functional group proactively identifies root causes of yield loss, signal integrity issues, and test coverage gaps, implementing corrective actions before production ramps. By embedding design-for-manufacturing principles into process development, the engineering team accelerates time-to-market by 40%, drives continuous cycle time reduction, and sustains first-pass yields above 99% for complex automotive, medical, and industrial electronics where technical rigor and reliability are non-negotiable.

8 function testing and programming lines
Operating 8 dedicated functional testing and firmware programming lines, this facility validates PCBA performance, signal integrity, power distribution, and microcontroller operation before product shipment. The functional test stations simulate real-world operating conditions to verify voltage rails, communication interfaces, and sensor responses, while the programming lines securely flash application firmware into onboard microchips. This integrated test-and-program approach captures both hardware and software defects at the final assembly stage, eliminating field failures caused by unprogrammed devices or marginal electrical performance. The 8-line parallel configuration supports high-volume throughput with 100% electrical screening, significantly reducing customer returns and warranty claims for demanding automotive and medical applications.

6 Conformal Coating Lines
this facility applies protective polymer layers that shield PCBA from moisture, dust, chemicals, and thermal extremes. The precision process prevents corrosion and electrical shorts, significantly extending product lifespan in harsh environments. This capability ensures long-term reliability for automotive under-hood systems, outdoor industrial controls, and aerospace electronics where environmental exposure is unavoidable.

3D X-Ray Machines
Employing advanced 3D X-ray inspection systems, this facility non-destructively examines solder joints, BGA voids, and internal PCB structures to ensure uncompromised PCBA quality. The three-dimensional imaging capability reveals hidden defects such as head-in-pillow, insufficient wetting, and micro-cracks that 2D AOI cannot detect. Automated void calculation quantifies BGA void ratios against IPC Class 2/3 standards, enabling real-time process correction. This non-invasive inspection method eliminates destructive cross-sectioning, reduces inspection cycle time by 40%, and ensures reliable performance for automotive, aerospace, and medical electronics where latent defects are mission-critical.

                     

Shenzhen Jingxin Electronic Technology Co., Ltd. - Professional PCB & PCBA Manufacturer
Established in 2002, Shenzhen Jingxin Electronic Technology Co., Ltd. is a leading PCB manufacturing and PCBA assembly company specializing in high-precision electronic manufacturing services. As a certified national high-tech enterprise and a Shenzhen government-recognized "Specialized, Refined, Distinctive, and Innovative" enterprise, we focus on intelligent control module R&D and one-stop PCB solutions.

Advanced Production Capabilities:
1.20,000 sqm dust-free workshop with 800+ employees
2.30+ production lines, including 18 fully automated SMT lines and 13 DIP lines
3. End-to-end services: PCB fabrication, SMT assembly, DIP soldering, aging testing, and more
4. Supports small-batch prototyping to large-scale mass production

 

Industries We Serve:
Medical equipment PCB
Industrial automation PCBA
New energy vehicle electronics
5G communication PCB
Aerospace & drone electronics
Robotics & LED display control boards

 

Certifications & Quality Standards:
ISO 9001, ISO 14001, IATF 16949, ISO 13485 certified
Five-Star Integrity Brand Enterprise (Shenzhen Government)Trust Jingxin Electronics for precision PCB assembly, innovative R&D, and end-to-end manufacturing solutions tailored to your needs.

 

Specification

PCB layers:	1-60 layers
PCB materials:	CEM1, CEM3, Rogers, FR-4, High Tg FR-4, Aluminum Base, Halogen Free
PCB max. board size:	620*1100mm
PCB certificate:	RoHS Directive-Compliant
PCB Thickness:	1.6 ±0.1mm
Out Layer Copper Thickness:	0.5-5oz
Inner Layer Copper Thickness:	0.5-4oz
PCB max. board thickness:	6.0mm
Minimum Hole Size:	0.20mm
Minimum Line Width/Space:	3/3mil
Min. S/M Pitch:	0.1mm(4mil)
Plate Thickness and Aperture Ratio :	30:1
Minimum Hole Copper:	20µm
Hole Dia. Tolerance(PTH):	±0.075mm(3mil)
Hole dia. Tolerance(NPTH):	±0.05mm (2mil)
Hole Position Deviation:	±0.05mm (2mil)
Outline Tolerance:	±0.05mm (2mil)
PCB surface finished:	HASL Leadfree,Immersion ENIG,Chem Tin,Flash Gold,OSP,Gold finger,Peelable,Immersion Silver
PCB solder mask:	Black, white, yellow ,etc
Legend:	White ,etc
E-test:	100% AOI, X-ray, Flying probe test.
Outline:	Rout and Score/V-cut
Inspection Standard:	IPC-A-610 CCLASSII
Certificates:	UL (E503048),ISO9001/ISO14001/IATF16949/ISO13485
Outgoing Reports:	Final Inspection, E-test, Solderability Test, Micro Section and More

Service Category	Capabilities
Material Sourcing	Electronic components procurement, supply chain management
Bare PCB Fabrication	Multilayer, rigid-flex, HDI, metal-core boards
Interconnect Solutions	Cable assemblies, wire harnesses, sheet metal, electrical cabinet integration
PCB Assembly	SMT (01005 to large format), BGA rework, DIP through-hole soldering
Testing & Quality	AOI, 3D X-Ray, In-Circuit Test (ICT), Functional Test (FCT) - 100% electrical screening
Protective Coating	Conformal coating (acrylic/silicone/urethane) against moisture, dust, chemicals
Production Scale	Prototype to high-volume mass production with flexible changeover

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FAQ

1. What is PCBA?
PCBA (Printed Circuit Board Assembly) refers to the process of soldering electronic components onto a PCB (Printed Circuit Board). Our China-based PCBA manufacturing services provide high-quality, cost-effective solutions for prototyping and mass production.

 

2. What PCBA services do you offer?

We provide complete turnkey PCBA solutions including:

PCB fabrication and assembly
Component sourcing and procurement
SMT (Surface Mount Technology) assembly
Through-hole assembly
Mixed technology assembly
Testing and quality inspection

3. What are your PCBA manufacturing capabilities?
Our China PCBA factory features:

SMT lines with high-precision placement machines
Automated optical inspection (AOI)
X-ray inspection for BGA components
Conformal coating and potting services
Functional testing capabilities
ISO-certified quality control

4. What file formats do you need for PCBA?
We accept all standard PCB design files:

Gerber files (RS-274X preferred)
Bill of Materials (BOM) in Excel/CSV
Centroid/Pick-and-place files
Schematic diagrams
Assembly drawings

5. What is your typical PCBA production lead time?
Standard lead times:

Prototype PCBA: 5-7 working days
Small batch production: 7-10 days
Mass production: 2-3 weeks (depending on order quantity)

6. How do you ensure PCBA quality?
Our quality assurance process includes:

DFM (Design for Manufacturability) analysis
Incoming component inspection
Solder paste inspection (SPI)
Automated optical inspection (AOI)
Functional testing
Final visual inspection

7. What certifications do your PCBA products have?
Our PCBA manufacturing complies with:

ISO 9001 quality management
IPC-A-610 standards
RoHS compliance
REACH compliance
UL certification available upon request

8. Can you help with component sourcing?
Yes, we offer complete component procurement services:

Access to authorized distributors
BOM cost optimization
Alternative component suggestions
Long-term supply chain management

9. What is your MOQ for PCBA orders?
We accommodate various order quantities:

Prototype: No MOQ (1 piece accepted)
Small batch: 10-100 pieces
Mass production: 100+ pieces
10. How do you handle PCBA shipping?
We offer multiple shipping options:

Express (DHL, FedEx, UPS)
Air freight
Sea freight
Door-to-door delivery
Custom clearance assistance