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| Customization: | Available |
|---|---|
| Type: | Rigid Circuit Board |
| Flame Retardant Properties: | V0 |
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| Specification: | |||||
| PCB layers: | 1-24layers | ||||
| PCB materials: | CEM1, CEM3, Teflon, Rogers, FR-4, High Tg FR-4, Aluminum Base, Halogen Free | ||||
| PCB max. board size: | 620mm*1100mm | ||||
| PCB certificate: | RoHS Directive-Compliant | ||||
| PCB Thickness: | 1.6 ±0.1mm | ||||
| Out Layer Copper Thickness: | 0.5-5oz | ||||
| Inner Layer Copper Thickness: | 0.5-4oz | ||||
| PCB max. board thickness: | 6.0mm | ||||
| Minimum Hole Size: | 0.20mm | ||||
| Minimum Line Width/Space: | 3/3mil | ||||
| Min. S/M Pitch: | 0.1mm(4mil) | ||||
| Plate Thickness and Aperture Ratio : | 30:1 | ||||
| Minimum Hole Copper: | 20µm | ||||
| Hole Dia. Tolerance(PTH): | ±0.075mm(3mil) | ||||
| Hole dia. Tolerance(NPTH): | ±0.05mm (2mil) | ||||
| Hole Position Deviation: | ±0.05mm (2mil) | ||||
| Outline Tolerance: | ±0.05mm (2mil) | ||||
| PCB solder mask: | Black, white, yellow | ||||
| PCB surface finished: | HASL Leadfree,Immersion ENIG,Chem Tin,Flash Gold,OSP,Gold finger,Peelable,Immersion Silver | ||||
| Legend: | White | ||||
| E-test: | 100% AOI, X-ray, Flying probe test. | ||||
| Outline: | Rout and Score/V-cut | ||||
| Inspection Standard: | IPC-A-610CCLASSII | ||||
| Certificates: | UL (E503048),ISO9001/ISO14001/IATF16949 | ||||
| Outgoing Reports: | Final Inspection, E-test, Solderability Test, Micro Section and More | ||||
| PCB Assembly OEM Service | |||||||
| Electronic Components Material Purchasing | |||||||
| Bare PCB Fabrication | |||||||
| Cable, Wire-harness Assembly, Sheet Metal, Electrical Cabinet Assembly Service | |||||||
| PCB Assembly Service: SMT, BGA, DIP | |||||||
| PCBA test: AOI, In-Circuit Test (ICT), Functioal Test (FCT) | |||||||
| Conformal Coating Service | |||||||
| Prototyping and Mass Production |
| PCBA ODM service | |||||
| PCB Layout, PCBA Design According To Your Idea | |||||
| PCBA Copy/Clone | |||||
| Digital Circuit Design / Analog Circuit Design/ lRF Design /Embedded Software Design | |||||
| Firmware and Microcode Programming Windows Application (GUI) Programming/Windows Device Driver (WDM) Programming | |||||
| Embedded User Interface Design / lSystem Hardware Design |

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