SMT DIP PCBA Reverse Engineering PCB

Product Details
Customization: Available
Metal Coating: Gold
Mode of Production: SMT
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  • SMT DIP PCBA Reverse Engineering PCB
  • SMT DIP PCBA Reverse Engineering PCB
  • SMT DIP PCBA Reverse Engineering PCB
  • SMT DIP PCBA Reverse Engineering PCB
  • SMT DIP PCBA Reverse Engineering PCB
  • SMT DIP PCBA Reverse Engineering PCB
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Basic Info.

Model NO.
Reverse Engineering PCB
Layers
Multilayer
Base Material
FR-4
Certification
RoHS, CCC, ISO
Customized
Customized
Condition
Used
PCB Soldermask
Green
PCB Silkscreen
White
PCB Thickness
0.6mm
PCB Layer
4 Layers
Surface Finished
HASL Lead Free
Copper Thickness
1oz Copper
PCB Materials
RF4 Tg170
PCBA Mini Footprint
01005
IC
BGA
IC Type
Qfn
PCB Type
Rigid PCB
PCB Tg
Tg
Aoi
100% Checking
BGA
X-ray 100% Testing
SMT Mini Size
01005
Transport Package
Carton Box
Specification
500 PCS/CTN
Trademark
Customer′s brand
Origin
China
HS Code
8534009000
Production Capacity
No Limited

Product Description

                                                        Product Description
Specification:
PCB layers:
1-24layers
PCB materials:
CEM1, CEM3, Rogers, FR-4, High Tg FR-4, Aluminum Base, Halogen Free
PCB max. board size:
620*1100mm
PCB certificate:
RoHS Directive-Compliant
PCB Thickness:
1.6 ±0.1mm
Out Layer Copper Thickness:
0.5-5oz
Inner Layer Copper Thickness:
0.5-4oz
PCB max. board thickness:
6.0mm
Minimum Hole Size:
0.20mm
Minimum Line Width/Space:
3/3mil
Min. S/M Pitch:
0.1mm(4mil)
Plate Thickness and Aperture Ratio :
30:1
Minimum Hole Copper:
20µm
Hole Dia. Tolerance(PTH):
±0.075mm(3mil)
Hole dia. Tolerance(NPTH):
±0.05mm (2mil)
Hole Position Deviation:
±0.05mm (2mil)
Outline Tolerance:
±0.05mm (2mil)
PCB surface finished:
HASL Leadfree,Immersion ENIG,Chem Tin,Flash Gold,OSP,Gold finger,Peelable,Immersion Silver
PCB solder mask:
Black, white, yellow
Legend:
White 
E-test:
100% AOI, X-ray, Flying probe test.
Outline:
Rout and Score/V-cut
Inspection Standard:
IPC-A-610CCLASSII
Certificates:
UL (E503048),ISO9001/ISO14001/IATF16949
Outgoing Reports:
Final Inspection, E-test, Solderability Test, Micro Section and More
PCB Assembly OEM Service
Electronic Components Material Purchasing
Bare PCB Fabrication
Cable, Wire-harness Assembly, Sheet Metal, Electrical Cabinet Assembly Service
PCB Assembly Service: SMT, BGA, DIP
PCBA test:AOI, In-Circuit Test (ICT), Functioal Test (FCT)
Conformal Coating Service
Prototyping and Mass Production
PCBA ODM service
PCB Layout, PCBA Design According To Your Idea
PCBA Copy/Clone
Digital Circuit Design / Analog Circuit Design/ lRF Design /Embedded Software Design
Firmware and Microcode Programming Windows Application (GUI) Programming/Windows Device Driver (WDM) Programming
Embedded User Interface Design / lSystem Hardware Design
SMT DIP PCBA Reverse Engineering PCBSMT DIP PCBA Reverse Engineering PCBSMT DIP PCBA Reverse Engineering PCBSMT DIP PCBA Reverse Engineering PCB
SMT DIP PCBA Reverse Engineering PCB
SMT DIP PCBA Reverse Engineering PCBSMT DIP PCBA Reverse Engineering PCBSMT DIP PCBA Reverse Engineering PCBSMT DIP PCBA Reverse Engineering PCBSMT DIP PCBA Reverse Engineering PCB
SMT DIP PCBA Reverse Engineering PCBSMT DIP PCBA Reverse Engineering PCB
SMT DIP PCBA Reverse Engineering PCBSMT DIP PCBA Reverse Engineering PCB
SMT DIP PCBA Reverse Engineering PCBSMT DIP PCBA Reverse Engineering PCB

 

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