| Customization: | Available |
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| Type: | Rigid Circuit Board |
| Dielectric: | FR-4 |
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Welcome to JingXin Electronics
We are a manufacturer who are specialized in PCB Assembly (SMT, DIP, AI) and electronic product final assembly (EMS) in the top market for global customers.
We have more than 20 years of SMT manufacturing experience, well appointed SMT ,DIP and assembly lines, offering one stop service from SMT,FPC,DIP,EMS, conformal coating, testing, final assembly, component procurement ,design, peripheral products support and so on. we are equipped with High-speed and accurately SMT Equipment ,and we provide a whole range of SPI,AOI,ICT,FCT,X-RAY,ROHS and aging testing for products. All ourshop floors are dust free, all lines are lead free, we are ISO9001 certified company.
We open bom cost quotation,with high quality control strategy and 8D analysis method,we focus on top market customers, such as PCBAs on medical , industrial , financial,robotic,automobile , New Energy.
We service for many global customers,such as the globe leader in grain processing and a leading solution provider;the top 3 in medical industry customer in China; the global leader in Telehealth Sensors industry and so on.
Our Working Team
Our Main Business:PCB PCBA
| PCB Manufacturing Capabilities: | |
| Layers | 1-32 Layers |
| Laminate | FR4, H-TG, Aluminum Base, Copper Base |
| Max. Board Size | 1200*500mm |
| Board Thickness | Max 3.6MM,Min 0.3MM |
| Min. Line Width/Trace | 0.05mm(2mil) |
| Max. Copper Thickness | 10 OZ |
| Min. S/M Pitch | 0.1mm(4mil) |
| Max. S/M Pitch | 0.2mm(8mil) |
| Min. Hole Dia. | 0.2mm(8mil) |
| Hole Dia. Tolerance(PTH) | ±0.05mm(2mil) |
| Hole Dia. Tolerance(NPTH) | ±0.05mm(2mil) |
| Hole Position Deviation | ±0.05mm(2mil) |
| Outline Tolerance | ±0.1mm(4mil) |
| Twist/Bent | 0.75% |
| Insulation Resistance | >1012Ω Normal |
| Electric Strength | >1.3kv/mm |
| S/M Abrasion | >6H |
| Thermal Stress | 288ºC 10Sec |
| Test Voltage | 50-300V |
| Min. Blind/Buried Via | 0.15mm(6mil) |
| Surface Treatment | OSP,HASL,LF-HASL,ENIG,Gold/Au Plating,Immersion Ag/Silver, |
| Ag/Silver Plating,Immersion Tin,Tin Plating | |
| Testing | E-test, Fly probe test |
| PCB Assembly Manufacturing Capabilities: | |
| Type of Assembly | SMT (Surface-Mount Technology) |
| DIP (Dual Inline-pin Package) | |
| SMT & DIP mixed | |
| Double-sided SMT and DIP assembly | |
| Solder Type | Water Soluble Solder Paste, Leaded process and Lead-Free (RoHS) |
| Components | Passives parts, smallest size 0201 |
| BGA, uBGA, QFN, SOP, TTSOP, and Leadless chips | |
| Fine Pitch to 0.8Mils | |
| BGA Repair and Reball, Part Removal and Replacement | |
| Connectors and Terminals | |
| Bare Board Size | Smallest:0.25''x 0.25'' (6.35mm x 6.35mm) |
| Largest: 20'' x 20'' (508mm x 508mm) | |
| Largest LED PCB: 47'' x 39'' (1200mm x 480mm) | |
| Min. IC Pitch | 0.012'' (0.3mm) |
| QFN Lead Pitch | 0.012'' (0.3mm) |
| Max. BGA size | 2.90'' x 2.90'' (74mm x 74mm) |
| Testing | X-ray Inspection |
| AOI (Automated Optical Inspection) | |
| ICT (In-Circuit Test)/Functional Testing | |
| Component Packaging | Reels, cut tape, Tube and tray, Loose parts and bulk |
SMT Manufacturing Capability And Manufacturing Machine
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SMT Manufacturing Capability
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Item
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Manufacturing Capability in process
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Manufacturing Method
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Production size(Min/Max)
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50×50mm / 500×500mm
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Production board thickness
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0.2 ~ 4mm
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Printing solder paste
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Support method
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Magnetism fixture, vacuo platform
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Sticking up by vacuo, clamping on both sides ,flexible clamping with sheet, flexible clamping with thick board
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Cleaning Method of printing solder paste
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Dry method+ wetting method+ Vacuo method
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Accuracy of printing
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±0.025mm
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SPI
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Repeated accuracy of volume
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<1% at 3σ
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Mounting component
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Components size
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0603(Option) L75mm Connector
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Pitch
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0.15mm
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Repeated accuracy
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±0.01mm
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AOI
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FOV size
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61×45mm
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Test speed
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9150mm²/Sec
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3D X-ray
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Shootingangle
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0-45
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PCB capabilities:
-1500mm long board PCB (FR4 and aluminium)
- FR4, 1 to 49 layer PCB either with HDI.
- 2 layer aluminium PCB
- Quick turn: 2L with 24 hours, 4L with 48 hours, 6L with 72 hours, 8L with 96 hours
- No min. order quantity, even 1 piece is workable.
PCBA capabilities:
-Components sourcing
-SMT & DIP assembly including BGA assembly
-Accepted SMD chips: 01005, BGA, QFP, QFN, TSOP
-Component height: 0.2-25 mm
-Min packing: 0201
-Min distance among BGA: 0.25-2.0 mm
-Min BGA size: 0.1-0.63 mm
-Min QFP space: 0.35mm
-Pick-placement precision: ±0.01 mm
-Placement capability: 0805, 0603, 0402, 0201
-High pin count press fit available
-SMT capacity per day: 7,000,000 point
Q1.What is needed for quotation?
A: PCB : Quantity, Gerber file and Technic requirements(material,surface finish treatment, copper thickness,board thickness ,...)
PCBA: PCB information, BOM, (Testing documents...)
Q2. What file formats do you accept for production?
A: Gerber file: CAM350 RS274X
PCB file: Protel 99SE, P-CAD 2001 PCB
BOM: Excel (PDF,word,txt)
Q3. Are my files safe?
A: Your files are held in complete safety and security.We protect the intellectual property for our customers in the whole process.. All documents from customers are never shared with any third parties.
Q4. MOQ?
A: There is no MOQ in JXE PCBA. We are able to handle Small as well as large volume production with flexibility.
Q5.Shipping cost?
A: The shipping cost is determined by the destination, weight, packing size of the goods. Please let us know if you need us to quote you the shipping cost.
Q6. Do you accept process materials supplied by clients?
A Yes, we can provide component source, and we also accept component from client
One-Stop OEM PCB Assembly Professional Turnkey PCBA
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