Customization: | Available |
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Type: | Combining Rigid Circuit Board |
Dielectric: | FR-4 |
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Jingxin PCBA Electronic Technology
Shenzhen Jingxin Electronic Technology Co., Ltd. is a professional enterprise dedicating to PCB and PCBA manufacturing for 20 years, providing professional OEM electronic manufacturing services for customers in various fields around the world. Since its establishment in 2002, the company has accumulated a group of engineers with more than ten years of manufacturing experience and professional electronic components purchasing team. With ten years of professional spirit, providing professional engineering services (PCB layout design, SMT process technology solutions, etc.) → PCB manufacturing → electronic components purchase → supply chain management → PCBA manufacturing (SMT and DIP) → one stop integrated manufacturing service from test, maintenance, aging test and assembly to directional development.
Our more than 800 employees are proud to serve customers in various fields including aerospace, medical equipment, industrial automatic control, new energy, automotive electronics, wearable device, 5G communication, drone and LED display, etc.
*Quality Policy
*Top Quality and high efficiency
*Improve continuously
*Achieve customer's satisfaction
Technical Capabilities:
PCB capability
Items | Mass production | Mass production | Prototype |
Layers | 32L | 6L | 40L |
Board type | Rigid PCB | FPC | Rigid&flex |
HDI Stackup | 4+n+4 | N/A | Any layer |
Max. Board Thickness | 10mm(394mil) | 0.30mm | 14mm(551mil) |
Min. Width | Inner Layer | 2.2mil/2.2mil | 2.0mil/2.0mil |
Outer Layer | 2.5/2.5mil | 2.2/2.2mil | |
Registration | Same Core | ±25um | ±20um |
Layer to Layer | ±5mil | ±4mil | |
Max. Copper Thickness | 6oz | 12oz | |
Min. Drill Hole Dlameter | Mechanical | ≥0.15mm(6mil) | ≥0.1mm(4mil) |
Laser | 0.1mm(4mil) | 0.050mm(2mil) | |
Max. Size (Finish Size) | Line-card | 850mm*570mm | 1000mm*600mm |
Backplane | 1250mm*570mm | 1320mm*600mm | |
Aspect Ratio (Finish Hole) | Line-card | 14:1 | 18:1 |
Backplane | 16:1 | 28:1 | |
Material | FR4 | EM827, 370HR, S1000-2, IT180A, EM825, IT158, S1000 / S1155, R1566W, EM285, TU862HF | |
High Speed | Megtron6, Megtron4, Megtron7,TU872SLK, FR408HR,N4000-13 Series,MW4000,MW2000,TU933 | ||
High Frequency | Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27 | ||
Others | Polyimide, Tk, LCP, BT, C-ply, Fradflex, Omega , ZBC2000, | ||
Surface Finish | HASL, ENIG, Immersion Tin, OSP, Immersion Silve, Gold Finger, Electroplating Hard Gold/Soft Gold, Selective OSP,ENEPIG |
PCBA capability
Process | Item | Mass production capability | |
SMT | Printing | Max PCB size | 900*600mm² |
Max PCB weight | 8kg | ||
Solder paste printing tolerance | ±25μm(6σ) | ||
System repeat calibration tolerance | ±10μm(6σ) | ||
Scraper pressure detection | pressure closed-loop control system | ||
SPI | Detect Min BGA PAD to PAD distance | 100μm | |
x-axis and Y-axis tolerance | 0.5μm | ||
False Rate | ≤0.1% | ||
Mount | Component size | 0.3*0.15 mm²--200*125 mm² | |
Component max height | 25.4mm | ||
Populate Max component weight | 100g | ||
BGA/CSP Min PAD spacing, and Min PAD diameter | 0.30mm,0.15mm | ||
Populate tolerance | ±22μm(3σ),±0.05°(3σ) | ||
PCB board size | 50*50 mm²-850*560 mm² | ||
PCB thickness | 0.3mm--6mm | ||
Max PCB weight | 6kg | ||
Populate Max components type | 500 | ||
AOI | Detect Min components | 01005 | |
Detect false type | Incorrect conponents,missing components,opposite direction,,component shift,Tombstone,Mounting on side,unsoldering,insufficient solder,Lead raised,Solder ball | ||
Foot warping detection | 3D Detection function | ||
Reflow | Temperature Accuracy | ±1ºC | |
Welding protection | nitrogen protection;(remaining oxygen<3000ppm) | ||
Nitrogen Control | Nitrogen closed-loop control system,±200ppm | ||
3D X-Ray | Magnification | Geometric Magnification;:2000 times;System Magnification:12000times | |
Resolution | 1μm /nm | ||
Rotation Angle &Slanting Perspective | Any ±45°+360°rotation | ||
DIP | Preelaboration | Automatic forming technology | Component Automatic forming |
DIP | DIP technology | Automatic Insertion machine | |
Wave soldering | Wave soldering type | Ordinary wave soldering | |
Inclination angle of transport guide rail | 4--7° | ||
Temperature accuracy | ±3ºC | ||
Soldering protection | nitrogen protection | ||
Non-welding pressure contact technology | Max PCB board size | 800*600mm² | |
Press down height accuracy | ±0.02mm | ||
Pressure Range | 0-50KN | ||
Pressure Accuracy | Standard value:±2% | ||
Hold time | 0-9.999S | ||
Conformal coating technology | Max PCB board size | 500*475*6mm | |
Max PCB board weight | 5kg | ||
Min Nozzle size | 2mm | ||
Other characteristic | Conformal coating pressure Programmable control | ||
ICT test | test level | Device level test,Test hardware connection status. | |
Test point | >4096 | ||
Test content | Contact test ,Open/short test,Resistance capacitance test test,diode, triode,mosfet test,No power on hybrid test,Boundary scan chain test,Power on mixed mode test. | ||
Assembly and test | Production type | TouchPad | Mass production |
TWS | Mass production | ||
Baby Camera | Mass production | ||
Gaming controller | Mass production | ||
Life Watch | Mass production | ||
FT test | test level | PCB board system level test.Test System function status. | |
Temperature cycling test | Temperature range | -60ºC--125ºC | |
Rise/lower temperature rate | >10ºC/min | ||
Temperature tolerance | ≤2ºC | ||
Other Reliability test | burn-in test,Drop test, vibration test , Abrasion test ,Key life test. |
View of Jingxin Electronic PCBA Assembly
1) Professional Surface-mounting and Through-hole soldering Technology
2) Various sizes like 1206,0805,0603 components SMT technology
3) ICT(In Circuit Test),FCT(Functional Circuit Test) technology.
4) PCBA Assembly With CE,FCC,Rohs Approval
5) Nitrogen gas reflow soldering technology for SMT.
6) High Standard SMT&Solder Assembly Line
7) High density interconnected board placement technology capacity.
Quick-turn Prototyping:
Fast-turn around 24 hours electronic print circuit board prototype Quick prototype turnkey electronic print circuit board Assembly within 7 days High end Manufacturer: Rigid, Flex,
Rigid-Flex, HDI, Metal Core, 10-40 layers etc. On-Demand Fabrication
Strong Supply Chain Management:
Consist of wide qualified distributor and huge selection in-stock. Components are ready to Ship or Assembly
100,000+ Parts In-stock components
2000m² Component Warehouse
800+ Qualified suppliers and vendors
50+ Experts Procurement Team
20+ sec Instant Result
7,000,000+ Parts Real-time Stock & Price
Prototyping (Quick-turn available)
Standard electronic print circuit board 1-10 layers FR4 · Originalbuild time 72h + shipping time 48h · Urgentbuild time 48h + shipping time 48h · Extra
Urgentbuild time 24h + shipping time 24h Advanced electronic print circuit board (10-40 layers, HDI etc.) · Originalbuild time 10-12 Days +
shipping time 48h
FAQ:
Q1. What is needed for quotation?
1.Gerber file & Bom list.
2. Clear pics of pcba or pcba sample for us.
3.Test method for PCBA.
Q2. What file formats do you accept for production?
1. Gerber Files (Eagle and electronic print circuit board File are available).
2. BOM list. (Excel(PDF, WORD, TXT)
3. Clear pictures of PCBA or PCBA samples to us.
4. Pick N Place file.
5. Test procedure for PCBA.
Q3. Are my files safe?
Your files are held in complete safety and security. We protect the intellectual property for our customers are never shared with any third parties.
Q4. MOQ?
There is no MOQ. We are able to handle small as well as large volume production with flexibility.
Q5. Shipping cost?
The shipping cost is determined by the destination, weight, packing size of the goods. Please let us know if you need us to quote you the freight.
Q6. How can you ensure the quality of the PCBs?
Our PCBs are 100% test including Flying Probe Test, E-test and AOI.
Q7. Can we visit your company?
No problem.You are welcome to visit us in Shenzhen.