Industrial Controller PCB Assembly Reverse Engineering Printed Circuit Board PCBA Clone

Product Details
Customization: Available
Type: Combining Rigid Circuit Board
Dielectric: FR-4
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  • Industrial Controller PCB Assembly Reverse Engineering Printed Circuit Board PCBA Clone
  • Industrial Controller PCB Assembly Reverse Engineering Printed Circuit Board PCBA Clone
  • Industrial Controller PCB Assembly Reverse Engineering Printed Circuit Board PCBA Clone
  • Industrial Controller PCB Assembly Reverse Engineering Printed Circuit Board PCBA Clone
  • Industrial Controller PCB Assembly Reverse Engineering Printed Circuit Board PCBA Clone
  • Industrial Controller PCB Assembly Reverse Engineering Printed Circuit Board PCBA Clone
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Basic Info.

Model NO.
JX-1305
Material
Complex
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
Electrolytic Foil
Base Material
Aluminum
Insulation Materials
Organic Resin
Model
PCB
Brand
Customer′s Brand
Based Material
Fr4/ Al/ FPC/ Cem-1/ Cem-3/ 94V0/ Rogers
Layer
1-32 Layers
Copper Thickness
18um-210um(6oz)
Board Thickness
1.6mm-3.2mm/ 0.2mm-1.2mm
Surface Treatment
HASL/ Enig/ Lf-Hal/ Immersion Tin/ Immersion Sin/
Solder Mask and Silkscreen
Green/White/Black/Red/Blue/Yellow
PCBA
1 to 36-Layer Rigid and 2-to 14-Layer Flex and Rig
Transport Package
Customized, ESD Bag/Vacuum Packaging+Bubble Bag,
Specification
Base material: FR4/ AL/ FPC/ CEM-1/ CEM-3/ 94v0/ R
Trademark
JXpcba
Origin
China
HS Code
9006599030
Production Capacity
40000000/Day

Product Description

Jingxin PCBA Electronic Technology

Shenzhen Jingxin Electronic Technology Co., Ltd. is a professional enterprise dedicating to PCB and PCBA manufacturing for 20 years, providing professional OEM electronic manufacturing services for customers in various fields around the world. Since its establishment in 2002, the company has accumulated a group of engineers with more than ten years of manufacturing experience and professional electronic components purchasing team. With ten years of professional spirit, providing professional engineering services (PCB layout design, SMT process technology solutions, etc.) → PCB manufacturing → electronic components purchase → supply chain management → PCBA manufacturing (SMT and DIP) → one stop integrated manufacturing service from test, maintenance, aging test and assembly to directional development.

Our more than 800 employees are proud to serve customers in various fields including aerospace, medical equipment, industrial automatic control, new energy, automotive electronics, wearable device, 5G communication, drone and LED display, etc.

Industrial Controller PCB Assembly Reverse Engineering Printed Circuit Board PCBA CloneIndustrial Controller PCB Assembly Reverse Engineering Printed Circuit Board PCBA CloneIndustrial Controller PCB Assembly Reverse Engineering Printed Circuit Board PCBA CloneIndustrial Controller PCB Assembly Reverse Engineering Printed Circuit Board PCBA CloneIndustrial Controller PCB Assembly Reverse Engineering Printed Circuit Board PCBA Clone

*Quality Policy 

           *Top Quality and high efficiency

                     *Improve continuously

                             *Achieve customer's satisfaction

 

Technical Capabilities:
 

PCB capability

Items Mass production Mass production Prototype
Layers 32L 6L 40L
Board type Rigid PCB FPC Rigid&flex
HDI Stackup 4+n+4 N/A Any layer
Max. Board Thickness 10mm(394mil) 0.30mm 14mm(551mil)
Min. Width Inner  Layer 2.2mil/2.2mil 2.0mil/2.0mil
Outer Layer 2.5/2.5mil 2.2/2.2mil
Registration Same  Core ±25um ±20um
Layer to Layer ±5mil ±4mil
Max. Copper Thickness 6oz 12oz
Min. Drill Hole Dlameter Mechanical ≥0.15mm(6mil) ≥0.1mm(4mil)
Laser 0.1mm(4mil) 0.050mm(2mil)
Max. Size (Finish Size) Line-card 850mm*570mm 1000mm*600mm
Backplane 1250mm*570mm 1320mm*600mm
Aspect Ratio (Finish Hole) Line-card 14:1 18:1
Backplane 16:1 28:1
Material FR4 EM827, 370HR, S1000-2, IT180A, EM825, IT158,  S1000 / S1155, R1566W, EM285, TU862HF
High Speed Megtron6, Megtron4, Megtron7,TU872SLK,  FR408HR,N4000-13 Series,MW4000,MW2000,TU933
High Frequency Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835,  CLTE, Genclad, RF35, FastRise27
Others Polyimide, Tk, LCP, BT, C-ply, Fradflex, Omega  , ZBC2000,
Surface Finish HASL, ENIG, Immersion Tin, OSP, Immersion  Silve, Gold Finger, Electroplating Hard Gold/Soft Gold, Selective OSP,ENEPIG

PCBA capability

Process Item Mass production capability
SMT Printing Max PCB size 900*600mm²
Max PCB weight 8kg
Solder paste printing tolerance ±25μm(6σ)
System repeat calibration tolerance ±10μm(6σ)
Scraper pressure detection pressure closed-loop control system 
SPI Detect Min BGA PAD to PAD distance 100μm
x-axis and  Y-axis tolerance 0.5μm
False Rate  ≤0.1%
Mount  Component size 0.3*0.15 mm²--200*125 mm²
Component max height 25.4mm
Populate Max component weight 100g
BGA/CSP Min PAD spacing, and Min  PAD diameter 0.30mm,0.15mm
Populate tolerance ±22μm(3σ),±0.05°(3σ)
PCB board size  50*50 mm²-850*560 mm²
PCB thickness 0.3mm--6mm
Max PCB weight 6kg
Populate Max components type 500
AOI Detect Min components 01005
Detect false type Incorrect conponents,missing components,opposite direction,,component shift,Tombstone,Mounting on side,unsoldering,insufficient solder,Lead raised,Solder ball
Foot warping detection 3D Detection function
Reflow Temperature Accuracy ±1ºC
Welding protection nitrogen protection;(remaining oxygen<3000ppm)
Nitrogen Control Nitrogen closed-loop control system,±200ppm
3D X-Ray Magnification Geometric Magnification;:2000 times;System Magnification:12000times
Resolution 1μm /nm
Rotation Angle &Slanting Perspective Any ±45°+360°rotation
DIP Preelaboration Automatic forming technology Component Automatic forming
DIP DIP technology Automatic Insertion machine
Wave soldering Wave soldering type Ordinary wave soldering
Inclination angle of transport guide rail 4--7°
Temperature accuracy ±3ºC
Soldering protection nitrogen protection
Non-welding pressure contact technology Max PCB board size 800*600mm²
Press down height accuracy ±0.02mm
Pressure Range 0-50KN
Pressure Accuracy Standard value:±2%
Hold time 0-9.999S
Conformal coating technology Max PCB board size 500*475*6mm
Max PCB board weight 5kg
Min Nozzle size 2mm
Other characteristic Conformal coating pressure Programmable control 
ICT test test level Device level test,Test hardware connection status.
Test point >4096
Test content Contact test ,Open/short test,Resistance capacitance test test,diode, triode,mosfet test,No power on hybrid test,Boundary scan chain test,Power on mixed mode test.
Assembly and test Production type TouchPad Mass production
TWS Mass production
Baby Camera Mass production
Gaming controller Mass production
Life Watch Mass production
FT test test level PCB board system level test.Test System function status.
Temperature cycling test Temperature range -60ºC--125ºC
Rise/lower temperature rate >10ºC/min
Temperature tolerance ≤2ºC
Other Reliability test burn-in test,Drop test, vibration test , Abrasion test ,Key life test.

Industrial Controller PCB Assembly Reverse Engineering Printed Circuit Board PCBA Clone
 


View of Jingxin Electronic PCBA Assembly

1) Professional Surface-mounting and Through-hole soldering Technology


2) Various sizes like 1206,0805,0603 components SMT technology


3) ICT(In Circuit Test),FCT(Functional Circuit Test) technology.


4) PCBA Assembly With CE,FCC,Rohs Approval


5) Nitrogen gas reflow soldering technology for SMT.


6) High Standard SMT&Solder Assembly Line


7) High density interconnected board placement technology capacity.


Industrial Controller PCB Assembly Reverse Engineering Printed Circuit Board PCBA Clone
 

Quick-turn Prototyping:

Fast-turn around 24 hours electronic print circuit board prototype Quick prototype turnkey electronic print circuit board Assembly within 7 days High end Manufacturer: Rigid, Flex,
Rigid-Flex, HDI, Metal Core, 10-40 layers etc. On-Demand Fabrication

Strong Supply Chain Management:

Consist of wide qualified distributor and huge selection in-stock. Components are ready to Ship or Assembly

100,000+ Parts In-stock components

2000m² Component Warehouse

800+ Qualified suppliers and vendors

50+ Experts Procurement Team

20+ sec Instant Result

7,000,000+ Parts Real-time Stock & Price

Industrial Controller PCB Assembly Reverse Engineering Printed Circuit Board PCBA CloneIndustrial Controller PCB Assembly Reverse Engineering Printed Circuit Board PCBA CloneIndustrial Controller PCB Assembly Reverse Engineering Printed Circuit Board PCBA Clone



Prototyping (Quick-turn available)

Standard electronic print circuit board 1-10 layers FR4 · Originalbuild time 72h + shipping time 48h · Urgentbuild time 48h + shipping time 48h · Extra
Urgentbuild time 24h + shipping time 24h Advanced electronic print circuit board (10-40 layers, HDI etc.) · Originalbuild time 10-12 Days +
shipping time 48h
 

Industrial Controller PCB Assembly Reverse Engineering Printed Circuit Board PCBA Clone

 

FAQ:

Q1. What is needed for quotation? 

1.Gerber file & Bom list.

2. Clear pics of pcba or pcba sample for us.

3.Test method for PCBA.  

 

Q2. What file formats do you accept for production? 

1. Gerber Files (Eagle and electronic print circuit board File are available).

2. BOM list. (Excel(PDF, WORD, TXT)

3. Clear pictures of PCBA or PCBA samples to us.

4. Pick N Place file.

5. Test procedure for PCBA.

 

Q3. Are my files safe? 

Your files are held in complete safety and security. We protect the intellectual property for our customers are never shared with any third parties.

 

Q4. MOQ? 

There is no MOQ. We are able to handle small as well as large volume production with flexibility.

 

Q5. Shipping cost? 

The shipping cost is determined by the destination, weight, packing size of the goods. Please let us know if you need us to quote you the freight.

 

Q6. How can you ensure the quality of the PCBs? 

Our PCBs are 100% test including Flying Probe Test, E-test and AOI.

 

Q7. Can we visit your company? 

No problem.You are welcome to visit us in Shenzhen.

 

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